| |
|
|
circular magnetrons |
| performance |
| |
| Typical Performance Parameters |
| |
Target
Diameter (in.) |
± 5% Uniformity
Diameter (in.) |
Utilization
(%) |
Rate |
| 1 |
0.5 |
25 |
* |
| 2 |
1 |
30 |
* |
| 3 |
2 |
40+ |
* |
| 4 |
3 |
40+ |
* |
| 6 |
4 |
40+ |
* |
| 8 |
6 |
40+ |
* |
| 10 |
8 |
40+ |
* |
| 12 |
10 |
40+ |
* |
| 16 |
14 |
40+ |
* |
|
| |
| Conditions :: stationary substrate, 5 mtorr pressure, 4 in. target to substrate distance |
| |
| Note :: Data in the above tables represent typical performance with standard magnetrons. Results may vary with process parameters such as pressure, flow rate, target cooling, type of power, power level, target material, etc. On request, Angstrom Sciences can provide special configurations to optimize performance on any of the above parameters. |
| |
| * Sputter rates are a function of power level, pressure, target material, source to substrate distance, etc. See separate "Sputter Rate" table for typical performance representative of the film deposition rate at maximum power density (i.e. about 250 w/in2, with direct cooling) and a 4 in. source to substrate distance. As a general rule, the rates will decrease linearly with lower power levels, and will decrease by about 50% for every two inches of increased target to substrate distance. Reducing the target to substrate distance by two inches will increase the film deposition rate by about 70%, all other factors remaining unchanged. |
|
