| |
|
|
rectangular magnetrons |
| performance |
| |
| Typical Performance Parameters |
| |
|
Target Length (in.) |
± 5% Uniformity
Length (in.) |
Utilization (%) |
Rate |
8 to 30 |
70% |
40+ |
* |
30 to 125 |
80% |
40+ |
* |
Others |
Special |
40+ |
* |
|
| |
| Conditions :: stationary substrate, 5 mtorr
pressure, 4 in. target to substrate distance, target width
greater than 2 in. |
| |
| Note :: Data in the above tables represent
typical performance with standard magnetrons. Results may vary with
process parameters such as pressure, flow rate, target cooling, type
of power, power level, target material, etc. On request, Angstrom
Sciences can provide special configurations to optimize performance
on any of the above parameters. |
| |
| * Sputter rates are a function of power level, pressure, target
material, source to substrate distance, etc. See separate "Sputter
Rate" table for typical performance representative of the film
deposition rate at maximum power density (i.e. about 250 w/in2, with
direct cooling) and a 4 in. source to substrate distance. As a general
rule, the rates will decrease linearly with lower power levels, and
will decrease by about 50% for every two inches of increased target
to substrate distance. Reducing the target to substrate distance by
two inches will increase the film deposition rate by about 70%, all
other factors remaining unchanged. |
|
