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Metallic bonding utilizes an Indium Alloy and is rated to 150 °C. A metallic bond provides good thermal and electrical conductivity and is recommended for most sputtering applications.
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Angstrom Sciences Appoints New Vice President of Business Development
October 21, 2009
Angstrom Sciences Expands R&D and Design Staff
April 11, 2008
Angstrom Sciences Awarded Patent 7,223,322
February 2, 2008
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Last Update: Jul 27, 2009
